Chemical Mechanical Planarization of Semiconductor Materials
| Author | : | |
| Rating | : | 4.52 (613 Votes) |
| Asin | : | 3540431810 |
| Format Type | : | paperback |
| Number of Pages | : | 428 Pages |
| Publish Date | : | 2017-06-04 |
| Language | : | English |
DESCRIPTION:
Amazon Customer said CMP: An Overview. This is an outstanding book. It provides an overview of the current status of CMP and serves as a significant update to Steigerwald's 1997 book, which summarized the state of CMP knowledge (which began for electronic applications in 1991)at that time. Much has happened in the second half of CMP's existence.The book is well edited by Mike Oliver. It includes chapter. Bing Hu said Nice book. The book arrived on time. This book is new and there is no mark on this book. That's what I want. Awesome.
The state of polishing models and their relation to experimental results are covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.. Polishing tools and consumables are also covered. This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals
. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed. Polishing tools and consumables are also covered. The state of polishing models and their relation to experimental results are covered. From the Back Cover This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals